Copper Powder 99.3%, Mesh 325
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Ultra-fine, high-purity copper powder with spheroidal particles.
SKU: CU301
Copper Powder 99.3%, Mesh 325
Ultra-fine, high-purity copper powder made via water atomization and hydrogen reduction. Features spheroidal particles and clusters, offering higher conductivity and lower density. Suitable for metal injection molding and applications requiring high conductivity and purity. Typical applications include conductive inks, paints, pastes, thermal sprays, and sintered products. Note: Pure copper powders may not exhibit conductivity under low-voltage tests but will show conductivity when compacted or mixed with oils or resins.
Product Specifications
Purity | 99.31% |
Hydrogen Loss | 0.39% |
Apparent Density | 2.97 g/cc |
Mesh Size | 325 mesh |
Sieve Analysis |
+60 Mesh: 0% -60/+80 Mesh: 0% -80/+100 Mesh: 0% -100/+140 Mesh: Trace -140/+200 Mesh: Trace -200/+325 Mesh: 0.6% -325 Mesh: 99.4% |
HTS Code | 7406.10.0000 |
NMFC | 30743 |
CAS No. | 7440-50-8 |
Applications and Benefits:
- Thick and thin film pastes
- Conductive inks, paints, and pastes
- Injection molding
- Thermal management
- EDM electrodes
- Antifouling paints
- Thermal sprays
- Sintered alloys/products
- Brazing/soldering paste
Caution:
Handle with care. Refer to the SDS for detailed safety guidelines.
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